EIS Capabilities

To make your project happen, the highly skilled staff in Electronics Instrument Services use the following abilities.

• Analog and digital design
• PCB design
• Embedded programming
• FPGA programming
• Design and implementation of wearable devices
• Computer vision design for open and closed loop systems
• Instrument and sensor interfaces
• Designing 3D(CAD) models
• Custom cable making
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The following instruments and tools are used to enable projects.

• Surface mount rework station, including BGA
• Thermal imagers
• Curve tracers
• Source Measuring Units
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3D Printers
QiDi Q2:

• - Max size: 10.63” x 10.63” x 10”
• - Layer resolution range 20 to 400 µm with a high dimensional accuracy of +/- 0.2mm

Makerbot Method X:

• - Layer resolution range 20 to 400 µm with a high dimensional accuracy of +/- 0.2mm

Form Lab II Resin Printer:

• - 25µm XY resolution and adjustable layer thickness ranging from 25 to 300 µm